斷裂伸長(zhǎng)率 | 200% | 拉伸強(qiáng)度 | 120MPa | 密度 | 1.26g/cm3 |
吸水率 | 0.21% | 用途級(jí)別 | 電子電器部件,薄膜級(jí) | 規(guī)格級(jí)別 | 耐熱,阻燃,高強(qiáng)度薄膜,電子電器部件 |
成型收縮率 | 5% | 特性級(jí)別 | 高強(qiáng)度,阻燃級(jí),高流動(dòng),耐高溫 |
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產(chǎn)品簡(jiǎn)述
斷裂伸長(zhǎng)率 | 200% | 拉伸強(qiáng)度 | 120MPa | 密度 | 1.26g/cm3 |
吸水率 | 0.21% | 用途級(jí)別 | 電子電器部件,薄膜級(jí) | 規(guī)格級(jí)別 | 耐熱,阻燃,高強(qiáng)度薄膜,電子電器部件 |
成型收縮率 | 5% | 特性級(jí)別 | 高強(qiáng)度,阻燃級(jí),高流動(dòng),耐高溫 |
詳細(xì)數(shù)據(jù)
訂購(gòu)指南
性能項(xiàng)目 | 測(cè)試方法 | 測(cè)試條件(狀態(tài)) | 測(cè)試數(shù)據(jù) | 數(shù)據(jù)單位 | |
物理性能 | 密度 | ISO 1183 | 1.26 | g/cm3 | |
收縮率 | Internal Method | 200℃,0.0500mm | 5.0-8.0 | % | |
吸水率 | ISO 62 | 平衡,23℃,0.0500mm,50%RH | 0.21 | % | |
機(jī)械性能 | 拉伸模量 | ISO 527-2 | 23℃,0.100mm | 1700 | MPa |
23℃,0.500mm | 1800 | ||||
23℃,0.0250mm | 1800 | ||||
拉伸應(yīng)力 | ISO 527-2 | 斷裂,23℃,0.100mm | 120 | MPa | |
斷裂,23℃,0.500mm | 120 | ||||
斷裂,23℃,0.0250mm | 130 | ||||
拉伸應(yīng)變 | ISO 527-2 | 斷裂,23℃,0.100mm | >200 | % | |
斷裂,23℃,0.0500mm | |||||
斷裂,23℃,0.0250mm | |||||
薄膜 | 褲型撕裂耐性 | ISO 6383-1 | 50µm | 6.30 | N/mm |
Puncture Resistance | Internal Method | 23℃,50µm | 40.0 | KJ/m2 | |
熱性能 | 線形膨脹系數(shù) | ASTM D-696 | 流動(dòng),0.0500mm | 0.000060 | cm/cm/℃ |
結(jié)晶峰溫(DSC) | 143 | ℃ | |||
電氣性能 | 體積電阻率 | ASTM D-257 | 23℃,0.0500mm | 2.0E+16 | ohm.cm |
介電強(qiáng)度 | ASTM D-149 | 23℃,0.0250mm | 270 | kV/mm | |
23℃,0.0500mm | 190 | ||||
23℃,0.100mm | 120 | ||||
介電常數(shù) | ASTM D-150 | 23℃,0.0500mm,10MHz | 3.30 | ||
耗散因數(shù) | ASTM D-150 | 23℃,0.0500mm,10MHz | 0.0030 | ||
Dielectric Breakdown | ASTM D-149 | 23℃,25.0µm | 6750 | V | |
23℃,50.µm | 9500 | ||||
23℃,125.0µm | 15000 |